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Effects of ultrasonic process on the adhesion of Cu/non-conductive PCB substrate in electroless copper plating
- Authors
- Kang, Jusuk; J.-S.; Lee; J.; Kwon; H.-W.; Lee, Jae-ho; J.-H.
- Issue Date
- 2017
- Citation
- 2017 International Conference on Electronics Packaging, ICEP 2017, pp.30 - 32
- Journal Title
- 2017 International Conference on Electronics Packaging, ICEP 2017
- Start Page
- 30
- End Page
- 32
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Related Researcher
- Lee, Jae Ho
- Engineering (Advanced Materials)