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Effects of complexing reagents on electroless nicke l-iron alloy plating for diffusion barrier of UBM
- Authors
- Koo, Ja-kyung; J.-K.; Lee, Jae-ho; J.-H.
- Issue Date
- 2015
- Citation
- ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, pp.300 - 303
- Journal Title
- ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
- Start Page
- 300
- End Page
- 303
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Related Researcher
- Lee, Jae Ho
- Engineering (Advanced Materials)