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Electrochemical kinetics study of electroless copper plating for electronics application
- Issue Date
- 2004
- Publisher
- TRANS TECH PUBLICATIONS LTD
- Keywords
- electroless copper plating; mixed potential; additive
- Citation
- DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2, v.449-4, pp.393 - 396
- Volume
- 449-4
- Start Page
- 393
- End Page
- 396
- ISSN
- 0255-5476
- Abstract
- Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations.
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Related Researcher
- Lee, Jae Ho
- Engineering (Advanced Materials)