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Wet Etching시 Ultrasonic의 주파수가 실리콘 웨이퍼 표면형상에 미치는 영향

Authors
Roh, Jae Seung
Issue Date
23-May-2013
Publisher
한국재료학회
Citation
2013년도 한국재료학회 춘계학술발표대회 및 제 24회 신소재 심포지엄, v.2013, no.1, pp.148
URI
https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/10056
Conference Name
2013년도 한국재료학회 춘계학술발표대회 및 제 24회 신소재 심포지엄
Place
KO
여수 엠블호텔
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College of Engineering (Department of Materials Science and Engineering)
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