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물유리를 이용한 고순도 나노실리카 제조
최진석; 이현권;
안성진
Article
Issue Date
2014
Citation
한국재료학회지, v.24, no.5, pp.271 - 276
Publisher
한국재료학회
Ag/Sn/Ag 샌드위치 구조를 갖는 Backside Metallization을 이용한 고온 반도체 접합 기술
최진석;
안성진
Article
Issue Date
2020
Citation
마이크로전자 및 패키징학회지, v.27, no.1, pp.1 - 7
Publisher
한국마이크로전자및패키징학회
Ti 쇼트키 배리어 다이오드의 Al 확산 방지를 위한 SC-1 세정 효과
최진석; 최여진;
안성진
Article
Issue Date
2021
Citation
한국재료학회지, v.31, no.2, pp.97 - 100
Publisher
한국재료학회
1
Discover
Author
An, sung jin
3
이현권
1
최여진
1
Subject
Ag/Sn/Ag sandwich structure
1
Al diffusion
1
backside metallization
1
die attach
1
high-temperature semiconductor
1
nano-silica powder
1
SC-1
1
Schottky barrier diode
1
sodium silicate
1
sol-gel
1
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Korean
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한국재료학회지
2
마이크로전자 및 패키징학회지
1
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