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QFP 솔더접합부의 크립특성에 관한 연구A Study on the Creep Characteristics of QFP Solder Joints
- Issue Date
- 2007
- Publisher
- 한국생산제조학회
- Keywords
- SMT electronic device; QFP; creep; solder; Sn-3Ag-0.5Cu; Sn-0.3Sb-0.4Ag-37.4Pb; SMT 전자부품; 크립; 솔더
- Citation
- 한국생산제조학회지, v.16, no.5, pp 151 - 156
- Pages
- 6
- Journal Title
- 한국생산제조학회지
- Volume
- 16
- Number
- 5
- Start Page
- 151
- End Page
- 156
- ISSN
- 2508-5093
2508-5107
- Abstract
- In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of 100℃ and 130℃under the load of 15～20% of average pull strength in solder joints. The creep characteristics of each solder joints were compared using the creep strain-time curve and creep strain rate-stress curves. Through the comparison, the Sn-3Ag-0.5Cu solder joints have higher creep resistance than that of Sn-0.3Sb-0.4Ag-37.4Pb. Also, the grain boundary sliding in the fracture surface and the necking of solder joint were observed by FE-SEM.
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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