ScholarWorks@Hanyang University ERICA Campus: 2. Conference Papers

2. Conference Papers(ETC > 2. Conference Papers)521

Browse

rss_1.0 rss_2.0 atom_1.0

Collection's Items (Sorted by Issue Date in Descending order): 481 to 500 of 521

침묵의 나선이론의 PR이론에의 적용 공중유형에 따른 자기의견 표명에 관한 연구: 성매매 처벌 특별법 이슈를 중심으로

ConferenceIssue Date2006

Directed assembly of nanoelements using electrostatically addressable templates

Xiong, X.; Makaram, P.; Bakhtari, K.; Somu, S.; Busnaina, A.; Small, J.; McGruer, N.; Park, J.

ConferenceIssue Date2006PlaceBoston, MA

Promoting Organ Donation through an Entertainment-Education TV Program in Korea: "Open Your Eyes"

ConferenceIssue Date2006

Structural dependence of Ghost mode in GaN-based laser diodes

ConferenceIssue Date2006

High-efficiency photodetedtor module package operating at 60GHz

ConferenceIssue Date2006

Effects of Corrosion inhibitor, 1H-Benzotriazole(BTAH), on Particle Adhesion in CU CMP

ConferenceIssue Date2006

Thermodynamics of titanium, nitrogen and oxygen in liquid stainless steels

Jo, N.-O.; Lee, J.-B.; Kim, S.-I.; Chung, T.-I.; Kim, W.-Y.; Pak, J.-J.; Park, J.-H.; Kim, D.-S.

ConferenceIssue Date2006PlaceSan Diego, CA

The adhesion of abrasive particle and organic residues during STI and Poly-silicon CMP

ConferenceIssue Date2005

Effects of Hydrogen Peroxide(H2O2) on Frictional and Thermal Characteristics during Cu CMP

ConferenceIssue Date2005

Effect of Corrosion Inhibitor(BTA) in Cu Slurry on Cu Polishing Go to Link

KIM, In-Kwon; KANG, Young-Jae; KIM, Tae-Gon; PARK, Jin-Goo

ConferenceIssue Date2005

<소나기>의 애니메이션화 전략

ConferenceIssue Date2005

The Effects of Chemicals in Post Cu CMP Cleaning Solutions on Silica and Alumina Particle Adhesion and Removal

ConferenceIssue Date2005

Nanotribological behavior of Cu oxide with silicon tipoxide with silicon tip

ConferenceIssue Date2005

Effect of corrosion inhibitor, benzotriazole (BTA), on particle adhesion in Cu CMP

ConferenceIssue Date2005

Effect of Slurry Chemistry on Cu CMP and Defects

ConferenceIssue Date2005

The adhesion of pad particles on wafer surfaces during Cu CMP

Song, Jae-Hoon; Han, Ja-Hyung; Hong, Yi-Koan; Kang, Young jae; Park, Jin-Goo; Maeng, Ju Ho; Won, Young Man

ConferenceIssue Date2005PlaceSan Francisco, CA

Characterization of the Aluminum and PMMA CMP(chemical mechanical polishing) for transparent plastic display Go to Link

Nam-Goo Cha; Young-Sam Yu; Young-Jae Kang; Chang-Hwa Park; Jin-Goo Park

ConferenceIssue Date2005

Frictional behavior and particle adhesion of abrasive particles during Cu CMP

Hong, Yi-Koan; Han, Ja-Hyung; Song, Jae-Hoon; Park, Jin-Goo

ConferenceIssue Date2005PlaceSan Francisco, CA

Effect of corrosion inhibitor (BTA) in Cu slurry on Cu polishing

ConferenceIssue Date2005

The adsorption behaviors of citric acid on abrasive particles in Cu CMP slurry

Kang, Young-Jae; Hong, Yi-Koan; Song, Jae-Hoon; Kim, In_Kwon; Park, Jin-Goo

ConferenceIssue Date2005PlaceSan Francisco, CA

first prev 21 22 23 24 25 26 27

Discover

CONTACT US

RSS_1.0 RSS_2.0 ATOM_1.0

55 Hanyangdeahak-ro, Sangnok-gu, Ansan, Gyeonggi-do, 15588, Korea+82-31-400-4269 sweetbrain@hanyang.ac.kr

COPYRIGHT © 2021 HANYANG UNIVERSITY. ALL RIGHTS RESERVED.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.

BROWSE

LIBRARY