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The Effect of Thermal Aging on Nano-Particle Removal
- Issue Date
- Feb-2021
- Publisher
- Scitec Publications Ltd.
- Keywords
- Cleaning; Footprint; Particle Defect; Thermal aging; Wafer backside
- Citation
- Solid State Phenomena, v.314 , pp 228 - 233
- Pages
- 6
- Indexed
- SCOPUS
- Journal Title
- Solid State Phenomena
- Volume
- 314
- Start Page
- 228
- End Page
- 233
- ISSN
- 1012-0394
1662-9779
- Abstract
- The adhesion behavior of thermally aged particles was studied by characterizing the footprint, which could be formed between a particle and a substrate. To understand the formation mechanism of the footprint, the effects of temperature and aging time on the particle removal were studied. Understanding the particle adhesion and removal aged at high temperatures is important to maintain the cleanness of the wafer backside where many contaminants could adhere on in various wafer process chambers.
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)