Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Characterization of Alkaline Cu/Ti Slurry for TSV Chemical Mechanical Planarization
- Authors
- 김태곤
- Issue Date
- 20-Nov-2023
- Place
- Busan, Korea
- Conference Name
- Korean International Semiconductor Conference on Manufacturing Technology 2023
- Files in This Item
- There are no files associated with this item.
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- KIM, TAE GON
- ERICA 공학대학 (MAJOR IN APPLIED MATERIAL & COMPONENTS)