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Relative lifetime estimation of EUV pellicle by normalized thermal stress

Authors
Jeon, Ji-HyunSon, Seung-WooOh, Hye-Keun
Issue Date
Oct-2024
Publisher
SPIE-INT SOC OPTICAL ENGINEERING
Keywords
EUV lithography; Pellicles; Pellicle lifetime; Thermal stress; Source power; Pinhole defect; Metal-silicide composites; Carbon nanotubes
Citation
INTERNATIONAL CONFERENCE ON EXTREME ULTRAVIOLET LITHOGRAPHY 2024, v.13215, pp 1 - 8
Pages
8
Indexed
SCIE
SCOPUS
Journal Title
INTERNATIONAL CONFERENCE ON EXTREME ULTRAVIOLET LITHOGRAPHY 2024
Volume
13215
Start Page
1
End Page
8
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/125258
DOI
10.1117/12.3038648
ISSN
0277-786X
1996-756X
Abstract
The lifetime of pellicles is difficult to predict accurately due to the influence of various factors. However, even an approximate estimation would be highly useful. To address this, we proposed a criterion for comparing pellicle lifetimes using a fatigue curve. By modeling the EUV exposure environment, we calculated the thermal stress on pellicles and applied it to the fatigue curves to analyze the lifetime variations based on pellicle materials, structures, source power, and defects. As a result, the metal silicide and carbon nanotube structures had stable lifetimes even under high source power, showing their potential as next-generation pellicle materials. Furthermore, we found that pinhole defects within the pellicles significantly reduced their lifetimes.
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Son, Seung-Woo
ERICA 첨단융합대학 (ERICA 지능정보양자공학전공)
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