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Impact of the non-uniform intensity distribution caused by a meshed pellicle of extreme ultraviolet lithography

Authors
Ko, Ki-HoPark, Jin-GooAhn, Jin-HoYeung, MichaelBarouch, EytanOh, Hye-Keun
Issue Date
Aug-2015
Publisher
Elsevier BV
Keywords
EUVL; Pellicle; EUV pellicle; Meshed pellicle; Mask defect control
Citation
Microelectronic Engineering, v.143, pp.31 - 36
Indexed
SCIE
SCOPUS
Journal Title
Microelectronic Engineering
Volume
143
Start Page
31
End Page
36
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/17444
DOI
10.1016/j.mee.2015.03.009
ISSN
0167-9317
Abstract
A physical optics simulation was performed to simulate intensity non-uniformity on a wafer passing through an extreme ultraviolet meshed pellicle. The non-uniformity is directly related to the coherence radius of the illumination and the mesh parameters. The intensity non-uniformity was reduced when using illumination conditions with a larger coherence radius in a fixed mesh pitch. The circular illumination sigma(r) = 0.5 can accommodate a five times larger pitch than the dipole illumination sigma(r) = 0.1. An aerial image simulation for a 16 nm half-pitch pattern was also performed to confirm the critical dimension uniformity (CDU) caused by the meshed pellicle. The CDU is directly proportional to the non-uniformity on the wafer in order to determine suitable mesh parameters that produce a small CDU through a non-uniform intensity distribution calculation. The non-uniformity on the wafer should be less than 0.2% in order to achieve the desired CDU less than 0.1 nm. (C) 2015 Elsevier B.V. All rights reserved.
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COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY > DEPARTMENT OF APPLIED PHYSICS > 1. Journal Articles
COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles

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Park, Jin Goo
ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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