Effects of pump-induced particle agglomeration during chemical mechanical planarization (CMP)
- Authors
- Seo, Young gil; Elaiyaraju, Periyasamy; Park, Jin-Goo
- Issue Date
- Nov-2014
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Citation
- ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014, pp.254 - 258
- Indexed
- SCIE
SCOPUS
- Journal Title
- ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
- Start Page
- 254
- End Page
- 258
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/20607
- DOI
- 10.1109/ICPT.2014.7017293
- Abstract
- In this study, the effects of large particle in chemical mechanical planarization (CMP) slurry were investigated on slurry distribution system, which utilizes a pumping device to circulate CMP slurry. Three different types of pumps (e.g., bellows, diaphragm and magnetically levitated centrifugal pump) were evaluated their performance such as generation of agglomerated particle and defectivity in different of slurries (Ceria slurry, Silica slurry a, Silica slurry b). © 2014 IEEE.
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