IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters

Abstract

In this paper, over a broad frequency band, a novel transmission line (TL) characterization method for highly-lossy miniaturized integrated circuit (IC) interconnect lines is presented. TLs fabricated on lossy organic substrates are difficult to characterize in a broad frequency band due to frequency-dependent losses and resonances. Test TLs are fabricated using a packaging process that employs an organic substrate and then characterized by using a vector network analyzer up to 40 GHz. TLs are modeled as a function of frequency by combining the modified skin effect model with experimental S-parameter data. Parallel admittance of TLs can be yielded by unifying the propagation constant with the frequency-variant resistance and inductance models, followed by TL characterization. It is verified that IC package interconnect lines can be reliably characterized up to high frequencies.