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구리와 니켈의 하이브리드 구조를 이용한 관통 실리콘 비아 전극의형성방법Fabrication of TSV with electrodeposited Cu and Ni
- Alternative Title
- Fabrication of TSV with electrodeposited Cu and Ni
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- 유봉영[유봉영]
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)