Random yield loss during wafer cleaning

Abstract

The cleaning process performance in both conventional wet-bath and a single-wafer processor was evaluated. Experiments performed in this study were primarily oriented toward the determination of the number of particles added onto the wafer by using various pumping methods. In particular, the impact of pump-induced particles on silicon wafer cleaning in DI water was investigated. The random yield of ICs was estimated from the particle count data using various correlations including a negative binomial model.