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Nano gas cluster dry cleaning for damage free particle removal

Authors
Kim, Min suKang, Bong KyunLee, Seung HoYoon, Deok jooChoi, HoomiKim, Ho joongKim, Tae sungPark, Jin-Goo
Issue Date
Dec-2010
Publisher
The Electrochemical Society
Citation
ECS Transactions, v.41, no.5, pp 229 - 236
Pages
8
Indexed
SCIE
SCOPUS
Journal Title
ECS Transactions
Volume
41
Number
5
Start Page
229
End Page
236
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/39151
DOI
10.1149/1.3630848
ISSN
1938-5862
1938-6737
Abstract
CO 2 gas cluster cleaning process for nano particles removal without pattern damage was investigated. Gas cluster cleaning process was performed for generating the nano-sized gas cluster in the vacuum chamber. When pressurized CO 2 gas was passed through the convergence-divergence (C-D) nozzle, the high speed and high energy gas clusters were generated. The cleaning force of CO 2 gas cluster is related to flow rate of the gas and gap distance between the nozzle and substrate. In our studies, the optimum gas flow rate and gap distance for nano-sized particles removal was found, respectively. Pattern damage tests of the poly-Si and a-Si pattern were also evaluated by SEM images. No pattern damages were observed at these optimum conditions. ©The Electrochemical Society.
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ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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