Collapse behavior and forces of multistack nanolines
- Authors
- Kim, Tae-Gon; Wostyn, Kurt; Mertens, Paul W.; Busnaina, Ahmed A.; Park, Jin-Goo
- Issue Date
- Jan-2010
- Publisher
- Institute of Physics Publishing
- Citation
- Nanotechnology, v.21, no.1, pp.1 - 7
- Indexed
- SCIE
SCOPUS
- Journal Title
- Nanotechnology
- Volume
- 21
- Number
- 1
- Start Page
- 1
- End Page
- 7
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/40031
- DOI
- 10.1088/0957-4484/21/1/015708
- ISSN
- 0957-4484
- Abstract
- Two types of multistack nanolines (MNLs), Si-substrate (Si)/siliconoxynitride (SiON)/amorphous Si (a-Si)/SiO2 and Si/SiO2/polycrystalline Si (poly-Si)/SiO2 were used to measure the collapse force and to investigate their collapse behavior by an atomic force microscope (AFM). The Si/SiON/a-Si/SiO2 MNL showed a larger length of fragment in the collapse patterns at a smaller collapse force. The Si/SiO2/poly-Si/SiO2 MNL, however, demonstrated a smaller length of fragment at a higher applied collapse force. The collapse forces increased by the square of the linewidth in both Si/SiON/a-Si/SiO2 and Si/SiO2/poly-Si/SiO2 MNLs. Once an AFM tip touches an Si/SiON/a-Si/SiO2 line, which is a softer MNL, it was delaminated first at the Si/SiON interface. One end of the delaminated line was first broken and then the other end was bent until it was broken. A harder MNL, Si/SiO2/poly-Si/SiO2, however, was broken at two ends simultaneously after the delamination occurred at the Si/SiO2/poly-Si interface. The different collapse behaviors were attributed to the magnitude of adhesion forces at the stack material interfaces and the mechanical strength of MNLs.
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