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Reevaluation of hydrogen gas dissolved cleaning solutions in single wafer megasonic cleaning
- Authors
- Kang, Bong Kyun; Lee, Seung Ho; Kim, In Jung; Choi, Eun Suck; Kim, Bong Woo; Busnaina, Ahmed.A.; Hattori, Takeshi; Park, Jin-Goo
- Issue Date
- Dec-2008
- Publisher
- Electrochemical Society, Inc.
- Citation
- ECS Transactions, v.25, no.5, pp 273 - 279
- Pages
- 7
- Indexed
- SCIE
SCOPUS
- Journal Title
- ECS Transactions
- Volume
- 25
- Number
- 5
- Start Page
- 273
- End Page
- 279
- ISSN
- 1938-5862
1938-6737
- Abstract
- The capability of hydrogenated DI water was reevaluated to apply to wafer cleaning instead of conventional cleaning chemicals. Its characteristics such as half life time, oxidation reduction potential (ORP), dissolved oxygen (DO) concentration, pH, and surface tension were measured as a function of hydrogen gas concentration. Also, hydrogenated DI water cleaning efficiency with addition of a very small amount of NH4OH by combining with megasonic (MS) was compared with cleaning efficiency of SC-1 and NH4OH spiked DI water. It was found that H2-DIW would be a valuable cleaning solution to avoid higher chemical consumption with better particle removal efficiency (PRE) than conventional cleaning solutions.
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)