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The dependence of chemical mechanical polishing residue removal on post-cleaning treatments
- Issue Date
- Dec-2007
- Publisher
- Trans Tech Publications Ltd
- Keywords
- And defect; Cleaning; CMP process; Dishing effect; Etching rate
- Citation
- Solid State Phenomena, v.134, pp 303 - 306
- Pages
- 4
- Indexed
- SCIE
SCOPUS
- Journal Title
- Solid State Phenomena
- Volume
- 134
- Start Page
- 303
- End Page
- 306
- ISSN
- 1012-0394
- Abstract
- [No abstract available]
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- There are no files associated with this item.
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)