Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver
- Authors
- Kim, Dongchurl; Shim, Jongin; Keh, Yong-Chan; Park, Munkyu
- Issue Date
- Jul-2006
- Publisher
- Institute of Electrical and Electronics Engineers
- Keywords
- distributed feedback laser diode (DFB-LD); 10-Gb/s-small-form-factor pluggable (XFP); semiconductor device packaging; transmitter optical subassembly (TOSA)
- Citation
- IEEE Journal on Selected Topics in Quantum Electronics, v.12, no.4, pp.776 - 782
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE Journal on Selected Topics in Quantum Electronics
- Volume
- 12
- Number
- 4
- Start Page
- 776
- End Page
- 782
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/44786
- DOI
- 10.1109/JSTQE.2006.876184
- ISSN
- 1077-260X
- Abstract
- A smart and compact packaging transmitter optical subassembly. (TOSA) in a 10-Gb/s small-form-factor pluggable (XFP) transceiver module has been developed with an eye towards electrical and thermal performances. In the TOSA, a bias-tee circuit and a matching resistor are monolithically integrated on an AIN submount with high thermal conductivity, and a newly proposed coplanar waveguide is drawn in a transistor outline (TO)-stem. In order to improve the electrical performance of the TOSA, the equivalent circuit model of all optoelectronic components in the TOSA is introduced and utilized. The fabricated TOSA shows the -3-dB bandwidth as high as 11 GHz and 0.36-dB penalty after a 75-km transmission at an elevated temperature of 85 degrees C.
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