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Highly integrated 10Gb/s optical sub-assembly and its circuit modeling
- Authors
- Shim, Jong In; Kim, D.
- Issue Date
- Oct-2006
- Publisher
- SPIE
- Keywords
- 10 Gb/s small form factor pluggable (XFP); Distributed feedback laser diode (DFB-LD); Semiconductor device packaging; Transmitter optical sub-assemble (TOSA)
- Citation
- Proceedings of SPIE - The International Society for Optical Engineering, v.6352 I, pp 1 - 8
- Pages
- 8
- Indexed
- SCOPUS
- Journal Title
- Proceedings of SPIE - The International Society for Optical Engineering
- Volume
- 6352 I
- Start Page
- 1
- End Page
- 8
- ISSN
- 0277-786X
- Abstract
- A highly integrated 10 Gb/s transmitter optical sub-assembly was fabricated and characterized for XFP transceiver. As a light source, uncooled 1.3 μm high-speed distributed feedback laser diode (DFB-LD) was fabricated and assembled on AlN sub-mount with a monitoring PD, a matching-resistor, and a bias-Tee with spiral-inductor. A glass sealed metallic low-loss TO-stem with in-line leads was newly presented. We developed a small-signal equivalent circuit model based on measured S-parameters in order to verify RF characteristics of LD and passive components. The eye-diagram of 10 Gb/s NRZ patterns with a PRBS 231-1 was opened clearly without mask violation. At 85°C, -3-dB bandwidth was measured as high as 11 GHz and 75-km transmission was successfully achieved with very low penalty.
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Related Researcher
- Shim, Jong In
- ERICA 첨단융합대학 (ERICA 반도체·디스플레이공학전공)