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Effects of Hydrogen Peroxide(H2O2) on Frictional and Thermal Characteristics during Cu CMP

Authors
박진구
Issue Date
23-Dec-2005
Publisher
Proceeding of CMP-MIC
Citation
Proceeding of CMP-MIC
Journal Title
Proceeding of CMP-MIC
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/45449
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COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles

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Park, Jin Goo
ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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