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A New TWA based Efficient Signal Integrity Verification Technique for Non-Uniform RLC Interconnect Lines
- Issue Date
- May-2005
- Publisher
- 대한전자공학회
- Keywords
- interconnect; non-uniform; inductance; signal integrity; TWA
- Citation
- 대한전자공학회 학술대회, pp 195 - 199
- Pages
- 5
- Indexed
- OTHER
- Journal Title
- 대한전자공학회 학술대회
- Start Page
- 195
- End Page
- 199
- Abstract
- A new TWA-based signal integrity verification technique for practical layout structures which are composed of non-uniform RLC lines with various discontinuities is presented. Transforming the non-uniform lines into virtual uniform lines, signal integrity of the practical layout structures can be very efficiently estimated by using the TWA-technique. It is shown that the proposed technique can estimate the signal integrity much more efficiently than generic SPICE model within 5% error.
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Related Researcher
- EO, YUNG SEON
- ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)