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Effects of patterns on corrosion in Cu CMP

Authors
Han, Ja hyungKoo, Ja eungHong, Duk hoPark, Byung lyulKim, Seong ilCho, In sooEom, Dae hongPark, Jin GooBusnaina, A.Samsung Electronics Co.
Issue Date
Dec-2004
Publisher
Scitec Publications Ltd.
Keywords
Corrosion; Cu CMP; Friction; Pattern dependence
Citation
Solid State Phenomena, v.103-104, pp 369 - 372
Pages
4
Indexed
SCIE
SCOPUS
Journal Title
Solid State Phenomena
Volume
103-104
Start Page
369
End Page
372
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46428
DOI
10.4028/www.scientific.net/SSP.103-104.369
ISSN
1012-0394
1662-9779
Abstract
Corrosion on specific Cu patterns was evaluated during Cu CMP. The corrosion was observed at isolated patterns and outer edge area of pad surrounded by oxide field after polishing and showed dependency on process. Two different commercial slurries were chosen and used for polishing after characterizing electrochemical and frictional properties. Stress simulations were conducted on these patterns. Higher stress was calculated on these patterns. The process temperature and friction behavior of Cu affected the magnitude of corrosion on Cu on these patterns.
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ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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