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Effects of patterns on corrosion in Cu CMP
- Authors
- Han, Ja hyung; Koo, Ja eung; Hong, Duk ho; Park, Byung lyul; Kim, Seong il; Cho, In soo; Eom, Dae hong; Park, Jin Goo; Busnaina, A.Samsung Electronics Co.
- Issue Date
- Dec-2004
- Publisher
- Scitec Publications Ltd.
- Keywords
- Corrosion; Cu CMP; Friction; Pattern dependence
- Citation
- Solid State Phenomena, v.103-104, pp 369 - 372
- Pages
- 4
- Indexed
- SCIE
SCOPUS
- Journal Title
- Solid State Phenomena
- Volume
- 103-104
- Start Page
- 369
- End Page
- 372
- ISSN
- 1012-0394
1662-9779
- Abstract
- Corrosion on specific Cu patterns was evaluated during Cu CMP. The corrosion was observed at isolated patterns and outer edge area of pad surrounded by oxide field after polishing and showed dependency on process. Two different commercial slurries were chosen and used for polishing after characterizing electrochemical and frictional properties. Stress simulations were conducted on these patterns. Higher stress was calculated on these patterns. The process temperature and friction behavior of Cu affected the magnitude of corrosion on Cu on these patterns.
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Related Researcher
- Park, Jin Goo
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)