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Effective Methods Controlling Cu Overburdens for Cu RDL Process
- Authors
- Park, Kimoon; Lee, Jinhyun; Yoo, Bongyoung
- Issue Date
- Jun-2018
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- Electropolishing; FOWLP; Microcontact printing; RDL; SAM
- Citation
- 2018 IEEE International Interconnect Technology Conference, IITC 2018, pp 106 - 108
- Pages
- 3
- Indexed
- SCIE
SCOPUS
- Journal Title
- 2018 IEEE International Interconnect Technology Conference, IITC 2018
- Start Page
- 106
- End Page
- 108
- ISSN
- 0000-0000
2380-6338
- Abstract
- Microcontact printing (μCP) and electrochemical polishing (ECP) were proceeded for the Cu overburden thickness reduction and Cu planarization during the redistribution layer process. The suppressing property of μCP and the polishing effect of ECP were confirmed by electrochemical analysis. Suppressing effect of top surface of trench was confirmed after the μCP and Cu filling, and the removal of Cu overburdens was also confirmed after the Cu filling and the ECP. © 2018 IEEE.
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)