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Ferroelectric Field-Effect Transistor Synaptic Device With Hafnium-Silicate Interlayer

Authors
Kim, Sang WooShin, WonjunKim, MunhyeonKwon, Ki RyunYim, JiyongKim, JeonghanHan, ChanghyeonJeong, SoiPark, Eun ChanYou, Ji WonKim, HyunwooChoi, RinoKwon, Daewoong
Issue Date
Dec-2023
Publisher
Institute of Electrical and Electronics Engineers
Keywords
FeFETs; Iron; Threshold voltage; Hafnium compounds; Zirconium; Capacitance; Ferroelectric FET; HZO; high-kappa interlayer; synaptic devices
Citation
IEEE Electron Device Letters, v.44, no.12, pp 1955 - 1958
Pages
4
Indexed
SCIE
SCOPUS
Journal Title
IEEE Electron Device Letters
Volume
44
Number
12
Start Page
1955
End Page
1958
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/196080
DOI
10.1109/LED.2023.3324695
ISSN
0741-3106
1558-0563
Abstract
A ferroelectric field-effect-transistor (FeFET) with hafnium zirconium oxide ferroelectric layer and hafnium silicate (HfSiOx) interlayer (IL) is demonstrated. Compared to a FeFET with SiO2 IL, the proposed FeFET is confirmed to have faster program/erase operations, wider memory window, and the improved endurance/retention characteristics due to the higher dielectric constant of HfSiOx and superior interfacial state between HfxZr((1-x))O-2 and IL. The proposed FeFET demonstrates a power spectral density that is approximately two times smaller than that of conventional FeFETs and endurance exceeding 1010 cycles. This underscores its enhanced suitability for neuromorphic computing applications.
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Kwon, Daewoong
COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)
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