Designing Robust Interfaces of HZO Module (>1012 at 85 °c) with High Sensing Margin (>300 mV) for ≤1.1 V 1T-1F with Common Plate Line and 1T-nF FeRAM
- Authors
- Jeon, Intak; Lim, Hanjin; Kim, Seon-yong; Kim, Jin-soak; Ahn, Sehyoung; Jung, Changhwa; Kwon, Daewoong; Kwon, Hyucknam; Park, Sung-Wook
- Issue Date
- Jul-2025
- Keywords
- Common plate line; 1T-1F; 1T-nF; HZO
- Citation
- Digest of Technical Papers - Symposium on VLSI Technology, pp 1 - 3
- Pages
- 3
- Indexed
- SCOPUS
- Journal Title
- Digest of Technical Papers - Symposium on VLSI Technology
- Start Page
- 1
- End Page
- 3
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/208720
- DOI
- 10.23919/VLSITechnologyandCir65189.2025.11075096
- ISSN
- 0743-1562
2158-9682
- Abstract
- Energy-efficient AI will be realized in conjunction with ferroelectric nT-mF in the near future. First, we present a ferroelectric module solution that is equipped with Pr-boosted HZO (2Pr 54 μ C/cm2) and universally improved ILs for FE, MPB and AFE. The films show high write/read endurance cycles (> 1012 at 85 °C). Second, we implement the solution into 1T-1F with a common plate line and 1T-nF FeRAM. We confirm sufficiently high sensing margins (≥300 mV).
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