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Digest of Technical Papers - Symposium on VLSI Technology

Journal Title

  • Digest of Technical Papers - Symposium on VLSI Technology

ISSN

  • 0743-1562

Publisher

Listed on(Coverage)

SJR 1999-2017;2019
CiteScore 2011-2019
SCOPUS 2017-2020

Active

  • Active

    based on the information

    • CITESCORE;

Article List

1 - 7 out of 7 results.

SCOPUS
Designing Robust Interfaces of HZO Module (>1012 at 85 °c) with High Sensing Margin (>300 mV) for ≤1.1 V 1T-1F with Common Plate Line and 1T-nF FeRAMGo to Link

Jeon, Intak; Lim, Hanjin; Kim, Seon-yong; Kim, Jin-soak; Ahn, Sehyoung; Jung, Changhwa; Kwon, Daewoong; Kwon, Hyucknam; Park, Sung-Wook

ArticleIssue Date2025CitationDigest of Technical Papers - Symposium on VLSI Technology, pp 1 - 3
SCOPUS
A Wireless Power and Synchronized Full-Duplex Data Transceiver IC with 400 Kbps Bidirectional Data Rate Using a Single Inductive Link for Low-Power SystemsGo to Link

Lee, Junhyuck; Kim, Yemin; Kim, Dongrim; Kang, Dongil; Song, Minsoo; Lee, Byunghun

ArticleIssue Date2025CitationDigest of Technical Papers - Symposium on VLSI Technology, pp 1 - 3
SCOPUS
Exploring FeFET Degradation Mechanisms: Mid-Interlayer as a Viable Solution for Stable Retention, Disturb Immunity, and Low Vth VariationGo to Link

Kim, Giuk; Lee, Sangho; Choi, Hyojun; Kim, Hoon; Shin, Seokjoong; Park, Sanghyun; Seo, Kwangyou; Kim, Kwangsoo; Kim, Wanki; Ahn, Jinho, et al.

ArticleIssue Date2025CitationDigest of Technical Papers - Symposium on VLSI Technology, pp 1 - 3
SCOPUS
Low-Damage Processed and High-Pressure Annealed High-k Hafnium Zirconium Oxide Capacitors near Morphotropic Phase Boundary with Record-Low EOT of 2.4Å & high-k of 70 for DRAM Technology

Gaddam, Venkateswarlu; Hwang, Junghyeon; Shin, Hunbeom; Kim, Chaeheon; Kim, Giuk; Kim, Hyung-Jun; Lee, Jooho; Kim, Hyun-Cheol; Park, Bumsu; Lim, Suhwan, et al.

ArticleIssue Date2024CitationDigest of Technical Papers - Symposium on VLSI Technology, pp 1 - 2
SCOPUS
In-depth Analysis of the Hafnia Ferroelectrics as a Key Enabler for Low Voltage & QLC 3D VNAND beyond 1K Layers: Experimental Demonstration and ModelingGo to Link

Kim, Giuk; Choi, Hyojun; Shin, Hunbeom; Lee, Sangho; Lee, Sangmok; Nam, Yunseok; Jung, Minhyun; Myeong, Ilho; Kim, Kijoon; Woo, Jongho, et al.

ArticleIssue Date2024CitationDigest of Technical Papers - Symposium on VLSI Technology, pp 1 - 2
SCOPUS
A 200Gb/s PAM-4 Transmitter with Hybrid Sub-Sampling PLL in 28nm CMOS TechnologyGo to Link

Wang, Zhongkai; Choi, Minsoo; Kwon, Paul; Lee, Kyoungtae; Yin, Bozhi; Liu, Zhaokai; Park, Kwanseo; Biswas, Ayan; Han, Jaeduk; Du, Sijun, et al.

ArticleIssue Date2022CitationDigest of Technical Papers - Symposium on VLSI Technology, v.2022-June, pp 34 - 35
SCOPUS
Fast Thermal Quenching on the Ferroelectric Al:HfO2 Thin Film with Record Polarization Density and Flash Memory ApplicationGo to Link

Ku, Boncheol; Choi, Seonjun; Song, Yun Heub; Choi, Changhwan

ArticleIssue Date2020CitationDigest of Technical Papers - Symposium on VLSI Technology, v.2020-June, pp 1 - 2
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