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2. Conference Papers(서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers)4,848

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Collection's Items (Sorted by Submit Date in Descending order): 1301 to 1320 of 4848

Magnetic Properties of Nanocrystalline Fe-Co Powders Produced by Mechanical Alloying

김영도

ConferenceIssue Date1999PlaceCanada Vancouver
Pulse Electric Current Sintering of Al2O3/Cu Nanocomposites

김영도

ConferenceIssue Date1999PlaceCanada Vancouver
Metal Injection Molding of W-Ni-Fe Heavy Alloy by Using of Binder Contained Ni and Fe Chloride

김영도

ConferenceIssue Date1999PlaceCanada Vancouver Canada Vancouver Canada Vancouver
A study on the properties of interlayer low dielectric polyimide during Cl-based plasma etching of aluminium

안진호

ConferenceIssue Date1999PlaceYokohama
Full Densification in the Injection Molded W-Ni-Fe Heavy Alloy with the Fe-Containing Binder System

김영도

ConferenceIssue Date1999PlaceEuropean
카본 박막을 이용한 다이오드형 평면 에미터의 전자 방출 특성에 관한 연구

안진호

ConferenceIssue Date1999Place부경대학교
열팽창 분석을 통한 기계적 합금화한 W-Cu 복합분말의 소결 거동 연구

김영도

ConferenceIssue Date1999Place인하대학교
The selective growth of aligned carbon nanotubes by PECVD using nickel catalyst

전형탁

ConferenceIssue Date1999PlaceSEATTLE
A study on the characteristics of TiN thin film deposited by atomic layer chemical vapor deposition method

전형탁

ConferenceIssue Date1999PlaceSEATTLE
A Study on the Characteristics of TiN Thin Film Deposited by Atomic Layer Chemical Vapor Depositon Method

김영도

ConferenceIssue Date1999PlaceWashington, U.S.
기계적 합금화법에 의한 NiAl합금분말제조 및 특성연구

김영도

ConferenceIssue Date1999Place울산대학교
Al2O3/Cu 나노복합분말의 제조 공정 및 소결특성 연구

김영도

ConferenceIssue Date1999Place울산대학교
금속사출성형을 위한 W-10wt%Cu 복합분말의 제조에 관한 연구

김영도

ConferenceIssue Date1999Place울산대학교
The reduction of the phase transition temperature of TiSi2 by introducing an Ta interlayer on Si(111)

전형탁

ConferenceIssue Date1999PlaceUSA
Application of the Finite Difference Method(FDM) to the Mass Transport in Ionic Solids

정용재

ConferenceIssue Date1999PlaceJapan, Sendai
전기분극된 실리카 유리의 비선형광학효과

신동욱

ConferenceIssue Date1999Place연세대학교
Dielectric Porperties with Baking Conditions and Anisotropy of Biphenyldianhydriede Phenylenediamine(PGDA-PDA) Polyimide

신동욱

ConferenceIssue Date1999PlaceSingapore
Fine Pitch, Low Temperature Solder Bump Formation by using Lift-Off Process

정용재

ConferenceIssue Date1999PlaceSingapore
The effect of Heat treatment on the emission of amorphous carbon film deposited by RF magnetron sputtering method

안진호

ConferenceIssue Date2000Place고려대
Deposition and characterization of pure Ta and TaX films for next generation mask application

안진호

ConferenceIssue Date2000Place고려대
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