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Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy
- Authors
- Park, Sung-Hyeon; Jang, Jin-Wook; Kim, Hak-Sung
- Issue Date
- Sep-2015
- Publisher
- IOP PUBLISHING LTD
- Keywords
- non-destructive; terahertz; void; IC package; detection
- Citation
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.25, no.9, pp.1 - 9
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- Volume
- 25
- Number
- 9
- Start Page
- 1
- End Page
- 9
- ISSN
- 0960-1317
- Abstract
- In this work, a terahertz time-domain spectroscopy (THz-TDS) imaging technique was used as a non-destructive inspection method for detecting voids in integrated circuit (IC) packages. Transmission and reflection modes, with an angle of incidence of 30 degrees, were used to detect voids in IC packages. The locations of the detected voids in the IC packages could be calculated by analyzing THz waveforms. Finally, voids that are positioned at the different interfaces in the IC package samples could be successfully detected and imaged. Therefore, this THz-TDS imaging technique is expected to be a promising technique for non-destructive evaluation of IC packages.
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Collections - 서울 공과대학 > 서울 기계공학부 > 1. Journal Articles
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)