Development of large area CoNi alloy electrodeposition process for stress free electroforming mold

Abstract

A 140mm CoNi alloy stamp for NIL was fabricated from a nano Si mother mold by using stress free electroforming method. CoNi alloys were electrodeposited from cobalt-nickel chloride electrolyte to investigate the influence of flow velocity of plating solution on CoNi film stress. Co and Ni contents were able to be controlled by changing flow rates and bath concentration of CoCl 2. The stress was reduced to 0 in the solution containing 0.008M CoCl2 at the flow velocity of 1 to 2 m/s. The process allows deposition of stress free CoNi alloys. The multiple duplication of a CoNi alloy stamp is possible without the consumption of costly Si mother stamp. Duplicated patterns on CoNi alloy stamp were compared with those of Si mother mold by using field emission scanning electron microscopy (FE-SEM) and atomic force microscophy (AFM). ©The Electrochemical Society.