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Showing results 1 to 18 of 18

SCOPUS
A New Cu-Zn Solder Wetting Layer for Improved Impact ReliabilityGo to Link

Kim, Young Min; Oh, Chang-Yul; Roh, Hee-Ra; Kim, Young Ho

ArticleIssue Date2009CitationProceedings - Electronic Components and Technology Conference, pp 1008 - 1013
SCOPUS
A New Ni-Zn under bump metallurgy for Pb-free solder bump flip chip applicationGo to Link

Cho, Hae-Young; Kim, Tae-Jin; Kim, Young Min; Kim, Sun-Chul; Park, Jin-Young; Kim, Young Ho

ArticleIssue Date2010CitationProceedings - Electronic Components and Technology Conference, pp 151 - 155
SCIESCOPUS
A new solder wetting layer for Pb-free soldersGo to Link

Oh, Chang Yul; Roh, Hee-Ra; Kim, Young Min; Lee, Jin Soo; Cho, Hae Young; Kim, Young-Ho

ArticleIssue Date2009CitationJournal of Materials Research, v.24, no.2, pp 297 - 300PublisherMaterials Research Society
SCOPUS
An eco-friendly Cu-Zn wetting layer for highly reliable solder jointsGo to Link

Kim, Young Min; Kim, Sun-Chul; Kim, Young-Ho

ArticleIssue Date2013CitationProceedings - Electronic Components and Technology Conference, pp 755 - 760
SCOPUS
Dependency of electrical characteristics on Au nano-crystal size for non-volatile memory fabricated with Au nano-crystal embedded in PVK(poly(N-vinylcarbazole)) layerGo to Link

Lee, Chang Kyu; Kwon, Jong Sung; Na, In Chul; Han, Byung Il; Kim, Young Min; Park, Jea Gun

ArticleIssue Date2007CitationSolid State Phenomena, v.124-126, no.PART 1, pp 33 - 36PublisherScitec Publications Ltd.
SCISCIESCOPUS
Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface FinishGo to Link

Kim, Young Min; Park, Jin-Young; Kim, Young-Ho

ArticleIssue Date2012CitationJournal of Electronic Materials, v.41, no.4, pp 763 - 773PublisherInstitute of Electrical and Electronics Engineers
SCISCIESCOPUS
Effect of Zn concentration on the interfacial reactions between Sn-3.0Ag-0.5Cu solder and electroplated Cu-xZn wetting layers (x=0-43 wt%)

Park, Jae-Yong; Kim, Young Min; Kim, Young-Ho

ArticleIssue Date2016CitationJournal of Materials Science: Materials in Electronics, v.27, no.6, pp 5916 - 5924PublisherKluwer Academic Publishers
SCISCIESCOPUS
Improved drop reliability of Sn-Ag-Cu solder joints by Zn addition to a Cu wetting layerGo to Link

Park, Jae-Yong; Kim, Young Min; Kim, Young-Ho

ArticleIssue Date2015CitationJournal of Materials Science: Materials in Electronics, v.26, no.8, pp 5852 - 5862PublisherKluwer Academic Publishers
SCISCIESCOPUS
Interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu-xZn (x=0-35 wt%) or Cu-xZn-yNi (x=20 and 25 wt%, y=15 and 10 wt%) substratesGo to Link

Kim, Young Min; Kim, Tae Jin; Choi, Min Young; Kim, Young-Ho

ArticleIssue Date2013CitationJournal of Alloys and Compounds, v.575, pp 350 - 358PublisherElsevier BV
SCISCIESCOPUS
Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy SubstratesGo to Link

Kim, Young Min; Roh, Hee-Ra; Kim, Sungtae; Kim, Young-Ho

ArticleIssue Date2010CitationJournal of Electronic Materials, v.39, no.12, pp 2504 - 2512PublisherInstitute of Electrical and Electronics Engineers
SCIESSCISCOPUS
Longitudinal analysis of online community dynamicsGo to Link

Baek, Seung Ik; Kim, Young Min

ArticleIssue Date2015CitationIndustrial Management and Data Systems, v.115, no.4, pp 661 - 677PublisherEmerald Group Publishing Ltd.
SCIESCOPUSKCICANDI
Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn-4.0Ag-0.5Cu and Cu-Zn SubstrateGo to Link

Kim, Young Min; Harr, Kyoung-Moo; Kim, Young-Ho

ArticleIssue Date2010CitationElectronic Materials Letters, v.6, no.4, pp 151 - 154Publisher대한금속·재료학회
SCOPUS
P-122: Fabrication of single substrate flexible LCD by laminating functional polymer cover filmGo to Link

Bae, Kwang Soo; Kim, Hak Rin; Kim, Young Min; Kim, Jae Hoon

ArticleIssue Date2007CitationDigest of Technical Papers - SID International Symposium, v.38, no.1, pp 661 - 664
SCOPUS
P-139: Control of liquid crystal pre-tilt angle using reactive mesogenGo to Link

Moon, Yeon-Kyu; Kim, Tae-Min; Choi, Min-Geon; Jeong, Jin-Hee; Lee, You-Jin; Yu, Chang-Jae; Kim, Young Min; Kim, ,Jae-Hoon

ArticleIssue Date2011CitationDigest of Technical Papers - SID International Symposium, v.42, no.1, pp 1630 - 1632
SCISCIESCOPUS
Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu soldersGo to Link

Kim, Tae Jin; Kim, Young Min; Kim, Young-Ho

ArticleIssue Date2012CitationJournal of Alloys and Compounds, v.535, pp 33 - 38PublisherElsevier BV
SCISCIESCOPUS
The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless solderingGo to Link

Lee, Jeong Hwan; Ma, Sung Woo; Kim, Young Min; Lee, Jin Su; Kim, Ki Bum; Kim, Jae Myun; Oh, Jae Sung; Kim, Namseog; Kim, Young-Ho

ArticleIssue Date2013CitationJournal of Materials Science: Materials in Electronics, v.24, no.9, pp 3255 - 3261PublisherKluwer Academic Publishers
SCIESCOPUS
The impact of an international faculty development program on simulation-based healthcare educationGo to Link

Chung, Hyun Soo; Issenberg, S. Barry; Phrampus, Paul; Miller, Geoff; Je, Sang Mo; Lim, Tae Ho; Kim, Young Min

ArticleIssue Date2012CitationMedical Teacher, v.34, no.6, pp 510 - 510PublisherTaylor & Francis
SCISCIESCOPUS
Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu soldersGo to Link

Lee, Ji Hyun; Kim, Young Min; Hwang, Ji Hwan; Kim, Young-Ho

ArticleIssue Date2013CitationJournal of Alloys and Compounds, v.567, pp 10 - 14PublisherElsevier BV
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