ScholarWorks@Hanyang University

2. Conference Papers(서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers)4,848

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Collection's Items (Sorted by Submit Date in Descending order): 4381 to 4400 of 4848

ALD trend and its application to gate spacer and charge trap layer

전형탁

ConferenceIssue Date2018
Synthetic Strategies for Incorporating Multiple Heterojunctions in Anisotropic Semiconductor Nanocrystals

오누리

ConferenceIssue Date2018Place서울 리버사이드호텔
Electrochemical analysis of modified BCZY electrolyte for enhanced proton - conducting fuel cells

신동욱

ConferenceIssue Date2018PlaceBerin, Germany
Deformation mechanisms and of two different high-entropy alloys: bcc NbMoCrTial vs. fcc CoCrFeMnNi

장재일

ConferenceIssue Date2018PlaceDarmstadt, Germany
Optical, Structural, and Resistive switching Characteristics of Atomic-Layer-Deposited ZnO Films with Their Thickness Variation

안진호

ConferenceIssue Date2018PlaceMexico Cancun Moon Palace Resort
Synthetic Strategies for Incorporating Multiple Heterojunctions in Anisotropic Semiconductor Nanocrystals

오누리

ConferenceIssue Date2018Place고려대학교
Recent Progresses of Atomic Layer Deposited Oxide Semiconductors and Their Device Applications

박진성

ConferenceIssue Date2018PlaceShenzhen, China
Robustness Enhancement of Adhesive Layer during Flexible Thin Film Transistor Fabrication by Atomic Layer Deposited Al2O3 Buffer Layer

박진성

ConferenceIssue Date2018PlaceShenzhen, china
Chemical Stable, Defect Suppression of Amorphous Sn-doped Indium Zinc Oxide (IZTO) Semiconductor Materials for Thin Film Transistor without Etch-stop Layer

박진성

ConferenceIssue Date2018PlaceShenzhen, china
Recent applications of nanoindentation for further understanding of advanced structural materials

장재일

ConferenceIssue Date2018PlaceGreater Columbus Convention Center, Columbus, OH, USA
An effective measurement method of electromagnetic shielding for 3D package application

김영호

ConferenceIssue Date2018Citation2018 International Microsystems, Packaging, Assembly and Circuits Technology ConferencePublisherInstitute of Electrical and Electronics Engineers: Electronics Packaging Society - TaipeiPlaceTaipei Nangang Exhibition Center, Taiwan
3D 프린팅으로 제조된 스테인리스 강의 나노역학 거동에 미치는 수소의 영향

장재일

ConferenceIssue Date2018Place대전컨벤션센터, 대전
가스 센싱 특성 향상을 위한 브랜치와 금속 나노입자의 형성

김현우

ConferenceIssue Date2018Place대전 DCC
초음파 용탕처리가 다성분다상 Al-14Si-CuNiMg 합금의 생성상 및 생성상 네트워크의 연결성에 미치는 영향

장재일

ConferenceIssue Date2018Place대전컨벤션센터, 대전
Nanoscale resistance switches from fundamentals to applications

정두석

ConferenceIssue Date2018Place창원
Effect of Ni-P microstructure on the interfacial IMC growth of ENIG/Sn-Ag-Cu

김영호

ConferenceIssue Date2018Citation17th International Symposium on Microelectronics and Packaging 2018PublisherKorean Microelectronics and Packaging SocietyPlaceCOEX, Seoul, Korea
Effect of Silane Modified Resin on Coefficient of Thermal Expansion of Non-Conductive Adhesive

김영호

ConferenceIssue Date2018Citation17th International Symposium on Microelectronics and Packaging 2018PublisherKorean Microelectronics and Packaging SocietyPlaceCOEX, Seoul, Korea
Mn계 천이금속 기반 자기열량 합금에서 Mn/Fe 비율에 따른 자기열량 특성의 변화에 대한 연구

김영도

ConferenceIssue Date2018Place대전 컨벤션센터
고압력 비틀림 공정을 가한 석출경화형 하이엔트로피 합금의 시간의존적 변형 거동

장재일

ConferenceIssue Date2018Place대전컨벤션센터, 대전
Effect of pre-lithiation on the electochemical performance of silicon monoixde negative electrode for all-solid-state lithium-ion batteries

신동욱

ConferenceIssue Date2018Place여수엑스포컨벤션센터
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