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MAJOR IN APPLIED MATERIAL & COMPONENTS (ERICA 소재·부품융합전공)
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Polyethyleneimine polymer as an effective corrosion inhibitor for advanced node tungsten post-CMP cleaning
Metal ion contamination and removal on oxide surfaces and polyvinyl acetal brushes during the tungsten post-CMP cleaning process
Effect of the additives on controlling ceria-brush chemical bonding during post-CMP cleaning
Interaction study of copper ions and polyvinyl acetal (PVA) brush during copper post-CMP cleaning: Experimental and density functional theory study
Combined Effects of PVA Brush Scrubbing Parameters and Processes on Post-CMP Cross-Contamination
Investigation of the Cross-Contamination Mechanism by PVA Brush Scrubbing Process and Parameters during Post-CMP Cleaning
Impact of CMP Slurry Additives on Copper Pad Corrosion and Surface Topography of Interest to Cu-Cu Hybrid Bonding
Investigation of silica particle and Mo ion contamination on PVA brush during Mo post-CMP cleaning process
Investigation of the root cause of the scratch formation during copper post-CMP brush scrubbing
Study of Chemical-Physical Cleaning Technologies for Better Particle Removal Trapped on the Crystal Defects of 4H-SiC
Changes in Surface Chemical Characteristics of 4H-SiC for Better Cleaning Performance
Differences in Surface Chemical Behavior and Cleaning Mechanism of Si and SiC
Electrochemical Study on Better Controllability of Cu Pad Topography in Cu/Ti CMP Seonwoo
Development of Physical Force-Assisted Wet Cleaning Process for Removing Highly Chemically Resistant Organic Residue
Study on the Chemical Durability and Defect Reduction Effects of Ceramic-Based CVD CMP Conditioners
Effect of Colloidal Silica and Molybdenum Ions on PVA Brush Loading during Mo Post-CMP Cleaning
Investigation and Characterization of Mo Surface during Mo Post-CMP Cleaning Process
Investigation of Surface Chemistry of 4H-SiC during RCA Cleaning Processes
Effect of Organic Amine on Ceria Contamination for Nitride Surface During STI CMP
A Novel Method to Evaluate the Contact Area of PVA Brushes during Post-CMP Cleaning
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Author
KIM, TAE GON
47
KIM, TAE GON
41
Park, Jin Goo
39
Yerriboina, Nagendra Prasad
14
Hamada, Satomi
9
Han, Kwang-Min
8
Park, Jin Goo
8
Ryu, Heon-Yul
8
Sahir, Samrina
8
Jalalzai, Palwasha
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Subject
EUV Mask
1
FABRICATION
1
Face to face
1
Fe(NO3)(3)
1
Field emission microscopes
1
FILM
1
Fin structures
1
final polished wafer
1
FLAKE DEFECT
1
Flowcharting
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Date Issued
2020 - 2026
59
2010 - 2019
10
2005 - 2009
12
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Article
46
Conference
37
Patent
5
Language
ENG
44
English
5
KOR
1
Journal
ECS Transactions
7
ECS Journal of Solid State Scienc...
6
Microelectronic Engineering
3
Polymer Testing
3
Applied Surface Science
2
ECS Journal of Solid State Scienc...
2
ECS Transactions
2
ICPT 2007 - International Confere...
2
Korean Journal of Materials Research
2
Materials Research Society Sympos...
2
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scopus
46
scie
29
sci
3
kci
2
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