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A fabrication of polyimide thin films containing high density oxide or metallic nanoparticles

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ConferenceIssue Date2010CitationThe 7th pacific rim international conference on advanced materials and processingPublisherMaterials AustraliaPlaceCairns, Australia
A highly reliable Cu-An alloy wetting Layer for Pb-free Solders on advanced materials

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ConferenceIssue Date2012Citation6th Korean Japan Berkeley SymposiumPublisherKITECHPlaceHearst Mining Building, University of California, Berkeley
SCOPUS
A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packagingGo to Link

Harr, Kyoung-Moo; Kim, Young-Min; Lim, Dae Hwan; Kim, Young Ho; Kim, Jin-Gu; Yi, Sung

ArticleIssue Date2009CitationProceedings - Electronic Components and Technology Conference, pp 1475 - 1478
SCIESCOPUS
A new COP bonding using non-conductive adhesives for LCDs driver IC packagingGo to Link

Chen, Zhi Gang; Kim, Young-Ho

ArticleIssue Date2006CitationDisplays, v.27, no.3, pp 130 - 135PublisherElsevier BV
SCOPUS
A New Cu-Zn Solder Wetting Layer for Improved Impact ReliabilityGo to Link

Kim, Young Min; Oh, Chang-Yul; Roh, Hee-Ra; Kim, Young Ho

ArticleIssue Date2009CitationProceedings - Electronic Components and Technology Conference, pp 1008 - 1013
SCOPUS
A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal PropertiesGo to Link

Park, Hwan-Pil; Park, Jae-Yong; Seo, Gwancheol; Kim, Young-Ho

ArticleIssue Date2017CitationProceedings - Electronic Components and Technology Conference, pp 2212 - 2217
A new fan-out package structure utilizing the selfalignment effect of molten solder to improve the die shift and enhance the thermal properties

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ConferenceIssue Date2017Citation2017 IEEE 67th Electronic Components and Technology ConferencePublisherInstitute of Electrical and Electronics EngineersPlaceLake Buena Vista, Florida, USA
A New Ni-Zn Under Bump Metallurgy for Pb-Free Solder Bump Flip Chip Application

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ConferenceIssue Date2010Citation60th Electronic Components and Technology ConferencePublisherIEEE, CPMPPlaceLas Vegas, Nevada USA
SCOPUS
A New Ni-Zn under bump metallurgy for Pb-free solder bump flip chip applicationGo to Link

Cho, Hae-Young; Kim, Tae-Jin; Kim, Young Min; Kim, Sun-Chul; Park, Jin-Young; Kim, Young Ho

ArticleIssue Date2010CitationProceedings - Electronic Components and Technology Conference, pp 151 - 155
SCIESCOPUS
A new solder wetting layer for Pb-free soldersGo to Link

Oh, Chang Yul; Roh, Hee-Ra; Kim, Young Min; Lee, Jin Soo; Cho, Hae Young; Kim, Young-Ho

ArticleIssue Date2009CitationJournal of Materials Research, v.24, no.2, pp 297 - 300PublisherMaterials Research Society
A Recent Advance in lead-free soldering

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ConferenceIssue Date2010Citation12th International Conference on Electronics Materials and PackagingPublisherIEEE, CPMTPlaceOrchard Hotel, Singapore
SCIESCOPUS
A study of the curing behavior of polyamic acid coated on a Cu or Zn layerGo to Link

Dong, Wen-Guo; Kim, Gun-Hong; Choi, Jae-Youn; Ybon, Jun-Ro; Kim, Young-Ho

ArticleIssue Date2008CitationColloids and Surfaces A: Physicochemical and Engineering Aspects, v.324, no.1-3, pp 122 - 125PublisherElsevier BV
ACA와 절연된 범프를 이용한 COG본딩

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ConferenceIssue Date2010Citation2010년도 추계 학술대회Publisher한국마이크로전자 및 패키징학회Place연세대학교
Adhesion between Electroless Seed Layers and build-up dielectric film substrates

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ConferenceIssue Date2012Citationinternational conference on Electronic Materials and Nanotechnology for Green EnvironmentPublisherInstitute of Electrical and Electronics EngineersPlaceRamada plaza Jeju hotel, Jeju island, Korea
Adhesion of Electroless-plated Copper to the Polymer Substrate

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ConferenceIssue Date2014CitationInternational Conference Electronic Materials and Nanotechnology for Green Environment 2014(ENGE 2014)PublisherKIM (The Korean Institute of Metals and Materials)PlaceJeju Island, Korea
SCISCIESCOPUS
Adhesion of NCF to oxidized Si wafers after oxygen plasma treatmentGo to Link

Jang, Min-Seok; Ma, Sung Woo; Song, Jongsoo; Sung, Myungmo; Kim, Young-Ho

ArticleIssue Date2017CitationMicroelectronics and Reliability, v.78, pp 220 - 226PublisherElsevier Ltd.
Adhesion of nonconductive film onto SiO2 substrates after oxygen plasma treatment

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ConferenceIssue Date2016CitationThe 15th International Symposium on Microelectronics and PackagingPublisherThe Korean Microelectronics and Packaging SocietyPlaceCOEX, Seoul, Korea
Adhesion of Thin Metal Films on Polymer Substrates

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ConferenceIssue Date2015Citation17th International Conference on Electronics Materials and PackagingPublisherKorean-American Scientists and Engineers AssociationPlacePortland, Oregon, USA
Adhesion of Thin Metal Films on the Polymeric Flexible Substrates

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ConferenceIssue Date2016CitationENGE 2016PublisherThe Korean Institute of Metals and MaterialsPlaceRamada Plaza Jeju Hotel, Jeju, Korea
SCISCIESCOPUS
Adhesion Study between Electroless Seed Layers and Build-up Dielectric Film SubstratesGo to Link

Sun, Jiang-Yan; Hong, Do-Hyeong; Ahn, Key-one; Park, Se-Hoon; Park, Ji-Yeon; Kim, Young-Ho

ArticleIssue Date2013CitationJournal of the Electrochemical Society, v.160, no.3, pp D107 - D110PublisherElectrochemical Society, Inc.
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