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Showing results 1 to 18 of 18

SCIESCOPUS
A study on water- mark defects in copper/ low-k chemical mechanical polishing

Han, Ja Hyung; Koo, Ja Eung; Choi, Kyo Se; Park, Byung Lyul; Chung, Ju Hyuck; Hah, Sang Rok; Lee, Sun Yong; Kang, Young-Jae; Park, Jin-Goo

ArticleIssue Date2008CitationSolid State Phenomena, v.134, pp 295 - 298PublisherScitec Publications Ltd.
KCI
Dishing and Erosion Evaluations of Tungsten CMP Slurry inthe Orbital Polishing SysteGo to Link

Lee, Sang-Ho; Kang, Young-Jae; Park, Jin-Goo; Kwon, Pan-Ki; Kim, Chang-Il; Oh, Chan-Kwon; Kim, Soo-Myoung; Jhon, Myung S.; Hur, Sean; Kim, Young-Jung, et al.

ArticleIssue Date2006CitationTransactions on Electrical and Electronic Materials, v.7, no.4, pp 163 - 166Publisher한국전기전자재료학회
SCISCIESCOPUS
Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline SiliconGo to Link

Venkatesh, R. Prasanna; Prasad, Y. Nagendra; Kwon, Tae-Young; Kang, Young-Jae; Park, Jin-Goo

ArticleIssue Date2012CitationJapanese Journal of Applied Physics, v.51, no.7, pp 1 - 6PublisherIOP Publishing Ltd
Effect of corrosion inhibitor (BTA) in citric acid based slurry on Cu CMP

Kim, In-Kwon; Kang, Young-Jae; Hong, Yi-Koan; Park, Jin-Goo

ConferenceIssue Date2005PlaceSan Francisco, CA
Effect of corrosion inhibitor, 1H-benzotriazole (BTAH), on particle adhesion in Cu CMP

Song, Jae-Hoon; Hong, Yi-Koan; Kim, Tae-Gon; Kang, Young-Jae; Kim, In-Kwon; Ran, Ja-Hyung; Park, Jin-Goo; Busnaina, Ahmed A.

ConferenceIssue Date2005Place미국; Los Angeles, CA
SCIESCOPUS
Effect of corrosion inhibitor, benzotriazole, in Cu slurry on Cu polishingGo to Link

Kim, In-Kwon; Kang, Young-Jae; Kim, Tae-Gon; Park, Jin-Goo

ArticleIssue Date2008CitationJapanese Journal of Applied Physics, v.47, no.1, pp 108 - 112PublisherIOP Publishing Ltd
SCIESCOPUS
Effect of polish by-products on copper chemical mechanical polishing behaviorGo to Link

Han, Ja-Hyung; Hah, Sang-Rok; Kang, Young-Jae; Park, Jin-Goo

ArticleIssue Date2007CitationJournal of the Electrochemical Society, v.154, no.6, pp H525 - H529PublisherElectrochemical Society, Inc.
SCOPUS
Effect of poly silicon wettability on polymeric residue contaminationGo to Link

Kang, Young-Jae; Park, Jin-Goo; Hong, Yi-Koan; Han, Sang Yeob; Yun, Seong Kyu; Yoon, Bo Un; Hong, ChangKi

ArticleIssue Date2007CitationECS Transactions, v.11, no.2, pp 455 - 461PublisherElectrochemical Society, Inc.
SCIESCOPUS
Effect of Polysilicon Wettability on Polishing and Organic Defects during CMPGo to Link

Park, Jin-Goo; Prasad, Y. Nagendra; Kang, Young-Jae; Kim, In-Kwon; Hong, Yi-Koan; Han, Sang-Yeob; Yun, Seong-Kyu; Yoon, Bo-Un; Busnaina, Ahmed A.

ArticleIssue Date2009CitationJournal of the Electrochemical Society, v.156, no.11, pp H869 - H873PublisherElectrochemical Society, Inc.
SCIESCOPUS
Effect of sodium periodate in alumina-based slurry on RuCMP for metal-insulator-metal capacitorGo to Link

Kim, In-Kwon; Kang, Young-Jae; Kwon, Tae-Young; Cho, Byoung-Gwun; Park, Jin-Goo; Park, Jum-Yong; Park, Hyung-Soon

ArticleIssue Date2008CitationElectrochemical and Solid-State Letters, v.11, no.6, pp H150 - H153PublisherElectrochemical Society, Inc.
Effect of wettability of poly silicon on CMP behavior

Kang, Young-Jae; Kang, Bong Kyun; Kim, In-Kwon; Park, Jin-Goo; Hong, Yi-Koan; Han, Sang Yeob; Yun, Seong Kyu; Yoon, Bo Un; Hong, Chang Ki

ConferenceIssue Date2007PlaceSan Francisco, CA
Effect of wettability of poly silicon on CMP behavior

Kang, Young-Jae; Kang, Bong-Kyun; Kim, In-Kwon; Park, Jin-Goo; Hong, Yi-Koan; Han, Sang Yeob; Yun, Seong-Kyu; Yoon, Bo-Un; Hong, Chang-Ki

ConferenceIssue Date2007PlaceSan Francisco, CA
SCIESCOPUS
Laser shock removal of nanoparticles from Si capping layer of extreme ultraviolet lithography masksGo to Link

Lee, Sang ho; Kang, Young-Jae; Park, Jin-Goo; Busnaina, Ahmed A; Lee, Jong myung; Kim, Tae hoon; Zhang, Guojing; Eschbach, Florence; Ramamoorthy, Arun

ArticleIssue Date2005CitationJapanese Journal of Applied Physics, v.44, no.7B, pp 5560 - 5564PublisherIOP Publishing Ltd
SCOPUS
Post W CMP cleaning without HF cleansGo to Link

Kang, Young-Jae; Yang, Chan Ki; Kwon, Tae Young; Park, Jin-Goo; Jo, Jung Hun; Lim, Geun Sik

ArticleIssue Date2007CitationECS Transactions, v.11, no.2, pp 441 - 445PublisherElectrochemical Society, Inc.
SCIESCOPUS
SAM modification of CMP conditioner for the prevention of particle adhesionGo to Link

Kwon, Tae Young; Kang, Young-Jae; Kim, In-Kwon; Kim, Dong Chan; Kim, Jeong; Chun, Jong sun; Park, Mun seak; Park, Jin-Goo

ArticleIssue Date2009CitationECS Transactions, v.25, no.5, pp 95 - 99PublisherElectrochemical Society, Inc.
SCISCIESCOPUS
Synthesis of Fe metal precipitated colloidal silica and its application to W chemical mechanical polishing (CMP) slurryGo to Link

Kang, Young-Jae; Prasad, Y. Nagendra; Kim, In-Kwon; Jung, Seok-Jo; Park, Jin-Goo

ArticleIssue Date2010CitationJournal of Colloid and Interface Science, v.349, no.1, pp 402 - 407PublisherAcademic Press
The adsorption behaviors of citric acid on abrasive particles in Cu CMP slurry

Kang, Young-Jae; Hong, Yi-Koan; Song, Jae-Hoon; Kim, In_Kwon; Park, Jin-Goo

ConferenceIssue Date2005PlaceSan Francisco, CA
SCIESCOPUS
The effect of hydrogen peroxide on frictional and thermal behaviors in a citric acid-based copper chemical mechanical planarization slurryGo to Link

Eom, Dae-Hong; Kim, In-Kwon; Kang, Young-Jae; Park, Jin-Goo

ArticleIssue Date2008CitationJapanese Journal of Applied Physics, v.47, no.7, pp 5385 - 5389PublisherIOP Publishing Ltd
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