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MAJOR IN APPLIED MATERIAL & COMPONENTS (ERICA 소재·부품융합전공)
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Effect of Colloidal Silica and Molybdenum Ions on PVA Brush Loading during Mo Post-CMP Cleaning
Investigation and Characterization of Mo Surface during Mo Post-CMP Cleaning Process
Characterization of Alkaline Cu/Ti Slurry for TSV Chemical Mechanical Planarization
Investigation of Surface Chemistry of 4H-SiC during RCA Cleaning Processes
Effect of Organic Amine on Ceria Contamination for Nitride Surface During STI CMP
A Novel Method to Evaluate the Contact Area of PVA Brushes during Post-CMP Cleaning
Effect of etchants and oxidizers on the Molybdenum surfaces during post-CMP cleaning process
Effect of Cleaning Chemicals on Defects of PVA Brush during Post-CMP Cleaning
A novel approach for PVA brush evaluation by contact area analysis during metal and oxide post-CMP cleaning
Evaluation and effective removal of organic impurity sources during the synthesis process of roller-type PVA brushes for efficient post-CMP cleaning
Contact and non-contact PVA brush conditioning during oxide and metal post-CMP cleaning
Photoelectrochemical Properties of Pulse-Reverse Electrodeposited Sb<sub>2</sub>Se<sub>3</sub>/TiO<sub>2</sub> Nanotube Photoanodes' Controlled Sb<sub>2</sub>Se<sub>3</sub> Overlayer
Pinpoint particle removal for EUV Pellicle Productivity Enhancement
Investigation of Selective Wet Etching of SiGe Substrates for High-Performance Device Manufacturing
Acoustic power dependent detachment of PSL particles adhered to glass surfaces by dissolved gas and anionic surfactant in an ultrasonic field
Investigation of Selective Wet Etching of SiGe Substrates for High-Performance Device Manufacturing
Benzethonium chloride as a tungsten corrosion inhibitor in neutral and alkaline media for the post-chemical mechanical planarization application
Effect of ammonium halide salts on wet chemical nanoscale etching and polishing of InGaAs surfaces for advanced CMOS devices
Selective removal of EUV-exposed particles from pellicle
Boosting performance of CdTe photocathode with pulse-reverse electrodeposited nickel telluride-nickel phosphide dual co-catalysts
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Author
KIM, TAE GON
67
Park, Jin Goo
37
Yerriboina, Nagendra Prasad
14
Hamada, Satomi
9
Ryu, Heon-Yul
8
Sahir, Samrina
7
Han, Kwang-Min
5
Lee, Jung-Hwan
5
Poddar, Maneesh Kumar
5
Cho, Hwi-Won
4
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Subject
Cleaning
8
REMOVAL
8
Semiconductor device manufacture
8
Chemical mechanical polishing
6
Post CMP cleaning
6
Post-CMP cleaning
6
(OTDR) technology
5
Blood vessel prostheses
5
Computer networks
5
Electric conductivity
5
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Date Issued
2020 - 2023
42
2010 - 2019
10
2007 - 2009
11
Type
Article
40
Conference
23
Patent
4
Language
English
28
ENG
11
Korean
1
Journal
ECS Journal of Solid State Scienc...
6
ECS Transactions
6
Microelectronic Engineering
3
Polymer Testing
3
Materials Science in Semiconducto...
2
Solid State Phenomena
2
한국재료학회지
2
Applied Surface Science
1
China Semiconductor Technology In...
1
Colloids and Surfaces A: Physicoc...
1
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25
kci
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