Recent Submissions

• Polyethyleneimine polymer as an effective corrosion inhibitor for advanced node tungsten post-CMP cleaning
• Metal ion contamination and removal on oxide surfaces and polyvinyl acetal brushes during the tungsten post-CMP cleaning process
• Effect of the additives on controlling ceria-brush chemical bonding during post-CMP cleaning
• Interaction study of copper ions and polyvinyl acetal (PVA) brush during copper post-CMP cleaning: Experimental and density functional theory study
• Combined Effects of PVA Brush Scrubbing Parameters and Processes on Post-CMP Cross-Contamination
• Investigation of the Cross-Contamination Mechanism by PVA Brush Scrubbing Process and Parameters during Post-CMP Cleaning
• Impact of CMP Slurry Additives on Copper Pad Corrosion and Surface Topography of Interest to Cu-Cu Hybrid Bonding
• Investigation of silica particle and Mo ion contamination on PVA brush during Mo post-CMP cleaning process
• Investigation of the root cause of the scratch formation during copper post-CMP brush scrubbing
• Study of Chemical-Physical Cleaning Technologies for Better Particle Removal Trapped on the Crystal Defects of 4H-SiC
• Changes in Surface Chemical Characteristics of 4H-SiC for Better Cleaning Performance
• Study on the Chemical Durability and Defect Reduction Effects of Ceramic-Based CVD CMP Conditioners
• Electrochemical Study on Better Controllability of Cu Pad Topography in Cu/Ti CMP Seonwoo
• Development of Physical Force-Assisted Wet Cleaning Process for Removing Highly Chemically Resistant Organic Residue
• Differences in Surface Chemical Behavior and Cleaning Mechanism of Si and SiC
• Investigation and Characterization of Mo Surface during Mo Post-CMP Cleaning Process
• Effect of Colloidal Silica and Molybdenum Ions on PVA Brush Loading during Mo Post-CMP Cleaning
• Investigation of Surface Chemistry of 4H-SiC during RCA Cleaning Processes
• Effect of Organic Amine on Ceria Contamination for Nitride Surface During STI CMP
• Characterization of Alkaline Cu/Ti Slurry for TSV Chemical Mechanical Planarization