ScholarWorks@Hanyang University ERICA Campus: 2. Conference Papers

2. Conference Papers(COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 2. Conference Papers)3,229

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Collection's Items (Sorted by Issue Date in Descending order): 21 to 40 of 3229

Low-Temperature Atomic Layer Deposition of High-Quality SiO2 Films Using Catalyst and In-situ Ozone Treatment

ConferenceIssue Date2024

Development of Thermal Dissipation Coating through Filler Structure Control for Efficient Thermal Management

ConferenceIssue Date2024Place서울대학교 시흥캠퍼스

Investigating the Role of Benzotriazole on Silica and Copper Ions Loading to Polyvinyl Acetal (PVA) Brush during Copper Post-CMP Cleaning

ConferenceIssue Date2024Place부산

Molecular Layer Deposition of a Tin-Based Organic-Inorganic Hybrid Thin Films for Photoresist

ConferenceIssue Date2024Place부산 파라다이스 호텔

Anisotropic Magnetorheological Elastomer Based on Single-Layer Carbonyl Iron Networks for Transparent Soft Actuator

ConferenceIssue Date2024Place광주

Anti-plasma and corrosion-resistant Al/Al2O3/Y2O3 multilayer substrate

ConferenceIssue Date2024Place광주광역시

Enhanced Magnetic Actuation and Dynamic Morphing Using Sm2Fe17N3 with Cu additive

ConferenceIssue Date2024Place광주광역시

Enhancement of Cu Electro Deposition on TGV Glass Substrate Interposer Using Pulse-reverse Current Electro Deposition

ConferenceIssue Date2024Place광주광역시

Fabrication of mechanically stable AAO template with improved hardness and thermal conductivity

ConferenceIssue Date2024Place광주광역시

Synthesis and Application of Copper Oxide Nanowire-based Heat Dissipation Plates

ConferenceIssue Date2024Place광주광역시

Enhancing Thermal Conductivity of Polymer Composites through Surface Hydroxylation of Hexagonal-Boron Nitride by Thermal Treatment

ConferenceIssue Date2024Place광주광역시

Enhanced Thermal Conductivity with High Filler-Content AlN/Epoxy Composites

ConferenceIssue Date2024Place광주광역시

The Study of Copper-to-Copper direct bonding process using Current induced enhancement method

ConferenceIssue Date2024Place한국

Potential Difference-Induced Electrodeposition of Defect-Rich α-Cobalt Hydroxide on Porous Copper (PCu) For High-Voltage Performance of Supercapacitor

ConferenceIssue Date2024Place한국

Enhancing Thermal Conductivity of Polymer Composites through Hydroxylation of Hexagonal-Boron Nitride

ConferenceIssue Date2024Place일본

Anti-plasma and Corrosion for Robust-Mechanical Al/Al2O3/Y2O3 Multilayer Substrate

ConferenceIssue Date2024Place일본

Highly Stable Conductive Transparent Electrode based on Ag@Au Coreshell Nanowires for Advanced Flexible Electronic Devices

ConferenceIssue Date2024Place일본

Eco-friendly Water based Organic Field-Effect Transistor Using Micro-emulsion and Simple Elimination of Surfactant

ConferenceIssue Date2024Place광주

Development of Efficient Polyurethane Based Heat Dissipation Film through Parylene CVD Coating

ConferenceIssue Date2024Place광주

Enhanced Growth Behavior and Electrical Properties of Atomic-Layer-Deposited La2O3 film at High Temperature Using Novel Precursor with Discrete Feeding Method

ConferenceIssue Date2024Place여수 디오션리조트

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