ScholarWorks@Hanyang University ERICA Campus: 2. Conference Papers

2. Conference Papers(COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 2. Conference Papers)3,229

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Collection's Items (Sorted by Issue Date in Descending order): 181 to 200 of 3229

Copper-to-Copper Direct Bonding Process Using Current-Induced Enhancement Method

ConferenceIssue Date2024Place한국

Effect of the Saccharin on the electrodeposition of invar composition Fe-Ni alloy

ConferenceIssue Date2024Place한국

Facile Direct electrodeposition of 2-Dimensional Zinc Telluride Layer on Silicon Dioxide by Electrochemically Generated Hydrogen Telluride

ConferenceIssue Date2024Place한국

Electrochemical technologies for advanced semiconductor packaging technologies

ConferenceIssue Date2024Place한국

The effect of self-annealing property on copper-to-copper bonding

ConferenceIssue Date2024Place한국

Advanced atomic layer deposition

ConferenceIssue Date2024PlaceInstitute of Space Technology(IST)/Islamabad/Pakistan

Development of Physical Force-Assisted Wet Cleaning Process for Removing Highly Chemically Resistant Organic Residue

ConferenceIssue Date2024Place경주

Differences in Surface Chemical Behavior and Cleaning Mechanism of Si and SiC

ConferenceIssue Date2024Place경주

Study on the Chemical Durability and Defect Reduction Effects of Ceramic-Based CVD CMP Conditioners

ConferenceIssue Date2024Place경주

Electrochemical Study on Better Controllability of Cu Pad Topography in Cu/Ti CMP

ConferenceIssue Date2024Place경주

Enhanced Deposition Selectivity of High-k Dielectrics by Vapor-Dosed Self-Assembled Monolayer Inhibitors Combined with Selective Lift-Off

ConferenceIssue Date2024

Develop Behavior of Metal Organic Chemical Vapor Deposited Sn-based Inorganic Dry Resist for Next-generation EUV Lithography

ConferenceIssue Date2024

Unlocking the Potential of Porous Bi2Te3-based Thermoelectrics Using Precise Interface Engineering through Atomic Layer Deposition

ConferenceIssue Date2024Place경주화백컨벤션센터

Low Temperature Crystallization of Atomic Layer Deposited SrTiO3 Films with Minimal Interfacial Reactions

ConferenceIssue Date2024Place경주화백컨벤션센터

Improved DRAM eletrode/dielectric interface properties using Nb2O5 and Ta2O5 ultrathin layer

ConferenceIssue Date2024

Optimization of process conditions of ZrO2 thin films deposited by atomic layer deposition using a new precursor

ConferenceIssue Date2024

The Effect of Process Pressure on Improving Resistivity of Ru Thin Films Deposited by Atomic Layer Deposition

ConferenceIssue Date2024

Stable Ferroelectric Properties of Sub-5 nm Hafnium-Zirconium-Oxide Thin Films Deposited via Atomic Layer Deposition

ConferenceIssue Date2024

Optoelectronic-synaptic properties of ReS2/MoS2 hetero-structure synthesized by chemical vapor deposition

ConferenceIssue Date2024

Multi-Stack Ferroelectric Capacitor Based on Fluorite Structure Materials for Neuromorphic Computing

ConferenceIssue Date2024

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