ScholarWorks@Hanyang University ERICA Campus: 2. Conference Papers

2. Conference Papers(COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 2. Conference Papers)3,229

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Collection's Items (Sorted by Issue Date in Descending order): 521 to 540 of 3229

Effect of colloidal silcia and copper ions on PVA brush contamination during post-Cu CMP cleaning

ConferenceIssue Date2022Place온라인

Effect of skin layer of PVA brush on static and dynamic contact area during post CMP cleaning

ConferenceIssue Date2022Place온라인

Investigation of Ceria-PAA interactions during STI CMP process leading to brush loading issues

ConferenceIssue Date2022Place온라인

Mechanism of metal ions adsorption on PVA brush during post CMP cleaning

ConferenceIssue Date2022Place온라인

Damage-free pinpoint particle removal for EUV pellicle cleaning

ConferenceIssue Date2022PlaceMonterey

Removal Behavior of Sn and Pb Contaminants on EUV mask after EUV Exposure

ConferenceIssue Date2022PlaceMonterey

Overview of Atomic Layer Patterning Process: toward AS-ALD & ALE

ConferenceIssue Date2022

Progress in electrochromic display fabricated by the dry deposition system

ConferenceIssue Date2022PlaceHangzhou, China

Design of the room-temperature quenching and aging medium Mn steel

ConferenceIssue Date2022Place강릉세인트존스호텔

금속간 화합물 B2 석출강화 중망간강의 시효 열처리 최적화

ConferenceIssue Date2022Place강릉세인트존스호텔

Study of Cu Electrochemical Polishing in a Novel Solution

ConferenceIssue Date2022Place체코

Novel fabrication of Fe-Si/SiO2 composite used for soft magnetic core made by Extrusion-based Additive Manufacturing

ConferenceIssue Date2022PlaceAnsan, Korea

Fabrication of Noble Metal-free Heterostructrue using ternary phased metal oxides (ZnO-SnO2-ZnSnO3) nanofibers for efficient photocatalytic application.

ConferenceIssue Date2022PlaceAnsan, Korea

Development of Cu doped TiO2 nanofibers for efficient hydrogen evolution under the whole light spectrum

ConferenceIssue Date2022PlaceAnsan, Korea

Cu to Cu direct bonding with optimized self-annealing behavior of the electroplated copper

ConferenceIssue Date2022Place미국

Ru electrodeposition and behaviors of additives for advanced technology nodes

ConferenceIssue Date2022Place미국

Li-Nb-O Protection Layer for Li-ion Battery Electrodes via Atomic-Layer-Deposition

ConferenceIssue Date2022PlaceThe International Convention Center (ICC) Ghent

Inherently Area-Selective Atomic Layer Deposition of SiO2 through Chemoselective Adsorption of an Aminodisilane Precursor on Oxide/Nitride Substrates

ConferenceIssue Date2022PlaceICC Ghent

Area-Selective Deposition of Ru Using Aldehyde-based Inhibitor,

ConferenceIssue Date2022Place인하대학교 61주년 기념관

신규 Hf 전구체를 이용한 고온 ALD HfO2 박막의 불순물 특성 개선

ConferenceIssue Date2022Place인하대학교

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