ScholarWorks@Hanyang University ERICA Campus: 2. Conference Papers

2. Conference Papers(COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 2. Conference Papers)3,229

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Collection's Items (Sorted by Issue Date in Descending order): 321 to 340 of 3229

Area-Selective Atomic Layer Deposition on Dielectric Substrates via Selective Adsorption of Small Molecule Inhibitors

ConferenceIssue Date2023

Area-Selective Atomic Layer Deposition of Ru Thin Films Using Phosphonic Acid Self-Assembled Monolayers for Metal/Dielectric Selectivity

ConferenceIssue Date2023

Enhanced Deposition Selectivity of High-k Dielectrics by Vapor-Dosed Phosphonic Acid Inhibitors Combined with Selective Lift-Off

ConferenceIssue Date2023

Microstructures-mechanical properties relationship of the partially-recrystallized, precipitation strengthened medium Mn steel

ConferenceIssue Date2023PlaceVienna

Challenges in Electric Steelmaking Technology for Reduction of CO2 Emissions (Keynote lecture)

ConferenceIssue Date2023PlaceKorea

Enhancing the electrical conductivity of nanoporous thermoelectric materials through ALD-based interface engineering

ConferenceIssue Date2023Place강원도 평창 알펜시아리조트

Nucleation behavior and growth characteristics of Atomic-Layer deposited Iridium thin films with TICP and Oxygen

ConferenceIssue Date2023Place강원도 평창 알펜시아리조트

Elucidating Smoothing Effect on Ultra-thin Ruthenium Films with the Combined Atomic Layer Deposition and Etching Process

ConferenceIssue Date2023

Improved DRAM Electrode Dielectric Interface Properties Using NbOx Film Using Area-Selective Atomic Layer Deposition

ConferenceIssue Date2023

Low-Temperature Chemical Vapor Deposition of SnOx Thin Film toward Next-Generation EUV Dry Resist

ConferenceIssue Date2023

Area-Selective Atomic Layer Deposition of Ruthenium Thin Films Using Vapor Dosing of Aldehyde Inhibitors on Various Substrates

ConferenceIssue Date2023

Copper-to-Copper Direct Bonding Process Using Current-Induced Enhancement Method

ConferenceIssue Date2023Place미국

Galvanic displacement deposition of Ag using citric acid for Cu-to-Cu hybrid bonding

ConferenceIssue Date2023Place독일

Uniformly Dispersed Cobalt Catalyst on the Coffee Waste-Derived Carbon Support for Hydrogen Evolution Reaction

ConferenceIssue Date2023Place미국

Area-Selective Atomic Layer Deposition of Ruthenium Thin Films by Chemo-Selective Adsorption of Short Alkylating Agents

ConferenceIssue Date2023

Area-Selective Atomic Layer Deposition of Ruthenium Thin films Using Aldehyde Inhibitors

ConferenceIssue Date2023

고등 원자층 증착법: Discrete feeding method 및 electric potential-assisted ALD를 통한 금속 극박막 성장

ConferenceIssue Date2023Place제주 소노벨

고등 원자층 증착법

ConferenceIssue Date2023Place제주 소노벨

고등 원자층 증착법: Discrete feeding method를 이용한 금속 산화물 박막 성장 공정

ConferenceIssue Date2023Place제주 소노벨

Effect of Cu Addition on Magnetic Properties and Microstructures of SmFe 11 Ti Alloys Prepared by Melt-Spinning

ConferenceIssue Date2023PlaceSendai, Japan

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